• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In one aspect, the present invention relates to a composite material including graphene platelets dispersed in a matrix. In some cases, the graphene platelets are randomly oriented within the matrix. The composite material can provide improved thermal conductivity and can be formed into heat sinks or other thermal management devices to provide improved cooling of electronic, electrical, and semiconductor devices.
    公开号:FR3020633A1
    申请号:FR1552000
    申请日:2015-03-11
    公开日:2015-11-06
    发明作者:Namsoo P Kim
    申请人:Boeing Co；
    IPC主号:
    专利说明:

    [0001] COMPOSITE MATERIAL CONTAINING GRAPHENE The present disclosure generally relates to composite materials, and more particularly to matrix composites comprising graphene nanoparticles. Composite materials, also known as composites or composites, are materials composed of two or more constituent materials having substantially different physical and / or chemical properties. When the two or more constituent materials are combined, a material is produced having different characteristics of the individual components. The new material may be preferred for many reasons. Common examples include materials that are stronger, lighter, or less expensive than conventional materials. Graphene includes sp2-bonded carbon as a primary carbon component, rather than spi-bonded carbon. For example, a graphene sheet is a flat sheet of one atom of sp2-bonded carbon thickness that is densely clustered in a honeycomb crystal lattice. Graphene materials have been combined with other materials to form composites, but some of these composites may be difficult and / or expensive to manufacture. In addition, some of these composites may have one or more properties that are not appropriate for certain applications. Therefore, improved graphene-containing composite materials are needed. According to one aspect of the present disclosure, a composite material comprises a matrix and graphene particles dispersed within the matrix, the graphene particles being randomly oriented in the matrix. Such a composite material may have improved thermal conduction properties and / or improved manufacturing facility over some other composite materials, including other composite materials used for thermal management applications. In another aspect, the matrix is thermally conductive and comprises a metal. In yet another embodiment, the matrix comprises or is formed of a metal selected from the group including aluminum, aluminum alloys, copper, copper alloys, titanium, titanium alloys, stainless steel, brass, and combinations of those -this. In some cases, the matrix comprises or is formed of a polymeric material, such as a thermoset polymeric material or a thermoplastic polymeric material. In addition, in some implementations, the graphene particles of a composite material described herein are in the form of a plurality of graphene platelets, and the composite comprises from about 1% by volume to about 40% by weight. volume or about 1% by volume to about 20% by volume of graphene, based on the total volume of the composite. In another aspect, the graphene platelets have an average thickness of about 0.3 nm to about 1 nm, about 1 nm to about 100 nm, about 1 nm to about 10 nm, about 1 nm at about 300 nm or about 1 nm to about 1000 nm. In another aspect, the present disclosure relates to a thermally conductive material comprising or formed of a composite material described herein. Still further, the present disclosure relates to thermally conductive components including thermally conductive materials made of or formed of a composite material described herein. In some implementations, the thermally conductive component is a heat sink, a heat sink or other thermal management component. Thus, the present disclosure also relates to thermal management and thermal conduction applications. One aspect of the present disclosure provides a composite material comprising: a metal matrix; and a plurality of graphene platelets dispersed in the metal matrix; wherein the graphene platelets are randomly oriented in the matrix. The metal matrix is advantageously thermoconductive. The metal matrix advantageously comprises aluminum, an aluminum alloy, copper, a copper alloy, titanium, a titanium alloy, or a combination thereof. The graphene platelets advantageously have an average thickness of about 1 nm to about 1000 nm. The platelets advantageously have an average thickness of about 0.3 nm to about 1 nm. The graphene platelets preferably have an average length and / or width (s) of about 1 μm to about 5 cm.
    [0002] The graphene platelets preferably have an average length and an average width of about 1 μm to about 1 cm. The composite preferably comprises graphene in an amount of from about 1% to about 40% by volume, based on the total volume of the composite.
    [0003] The composite preferably comprises graphene in an amount of from about 1% to about 20% by volume, based on the total volume of the composite. The composite material advantageously has a ductile-brittle transition temperature of the order of 15% of the ductile-brittle transition temperature of the matrix material without any graphene wafer.
    [0004] The composite material advantageously has a tensile strength of the order of 20% of the tensile strength of the matrix material without any graphene wafer. The platelets advantageously have an average thickness of about 1 nm to about 10 nm, an average length of about 1 μm to about 5 cm and an average width of about 1 μm to about 5 cm; and the composite comprises graphene in an amount of about 1% to about 20% by volume, based on the total volume of the matrix. The composite material advantageously has a ductile-brittle transition temperature of the order of 15% of the ductile-brittle transition temperature of the matrix material without any graphene wafer and / or a tensile strength of the order of 20%. % of the tensile strength of the matrix material without any graphene wafer. The platelets advantageously have an average thickness of about 0.3 nm to about 1 nm, an average length of about 1 μm to about 1 cm and an average width of about 1 μm to about 1 cm; and the composite comprises graphene in an amount of from about 1% to about 20% by volume, based on the total volume of the matrix. The composite advantageously has a ductile-brittle transition temperature of the order of 15% of the ductile-brittle transition temperature of the matrix material without any graphene wafer and / or a tensile strength of the order of 20%. the tensile strength of the matrix material without any graphene wafer.
    [0005] Another aspect of the present disclosure provides a thermally conductive material comprising the composite as mentioned above. The thermally conductive component advantageously comprises any of the aforementioned composite materials.
    [0006] The thermally conductive component is advantageously a heat sink or a heat sink. Another aspect of the present disclosure provides a method of thermal management of a heat generating component comprising: contacting any of the aforementioned heat-conducting materials with a heat-generating component; and transferring heat energy from the heat component to the heat conductive material. Other features and advantages of the present disclosure will become apparent from the following more detailed description of variants, taken in conjunction with the accompanying drawing, which illustrate, by way of example, the principles of the disclosure. Figure 1 illustrates an example of a graphene sheet according to an implementation described herein. The implementations described herein will be easier to understand when analyzing the following detailed description, examples, and drawing. The elements, apparatus, and methods described herein, however, are not limited to the specific implementations set forth in the detailed description, examples, and drawing. It should be recognized that these implementations are merely illustrative of the principles of the present disclosure. Many modifications and adaptations will become apparent to those skilled in the art without departing from the spirit and scope of the disclosure. In addition, all ranges shown here should be interpreted as encompassing any and all sub-ranges subsumed here. For example, a range of "1.0 to 10.0" should be considered to include any and all sub-ranges beginning with a minimum value of 1.0 or more and ending with a value of maximum of 10.0 or less, for example, 1.0 to 5.3, or 4.7 to 10.0, or 3.6 to 7.9. All ranges shown here should also be considered to include the ends of the range, unless expressly stated otherwise. For example, a range "between 5 and 10" should generally be considered to include ends 5 and 10. In addition, when the phrase "able to reach" is used in conjunction with a quantity or value, it should be understood that the quantity is at least a detectable amount or value. For example, a material present in an amount "up to" a specified amount may be present from a detectable amount up to the specified amount included. In one aspect, composite materials are described herein. In some implementations, a composite material comprises, consists, or consists essentially of a matrix and platelets of graphene dispersed in the matrix, the graphene platelets being randomly oriented in the matrix. With respect to the specific components of composite materials, the composite materials described herein include a matrix. In some cases, the matrix is thermoconductive. In addition, a matrix may comprise or be formed of any material that is not incompatible with the objects of the present disclosure. For example, in some cases, a matrix comprises or is formed of a metal. Any metal not inconsistent with the purposes of this disclosure may be used. In some implementations, the matrix of a composite material described herein comprises or is formed of a metal selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, titanium, titanium alloys, stainless steel, brass, and combinations thereof. In some examples, a matrix comprises or is formed of a non-metallic material, such as a polymeric material. Any polymeric material not incompatible with the objectives of the present invention can be used. In some cases, a polymeric material is selected from the group consisting of a thermoset material and a thermoplastic material. In some embodiments, a matrix comprises or is formed of a polycarbonate, a polyethylene such as a high density polyethylene, a polypropylene, a polyvinyl chloride (PVC), an acrylonitrile polymer. styrene -butadiene-styrene (ABS), a maleimide or bismaleimide, a phenol-formaldehyde polymer, a polyepoxide, a poly (ether ether ketone) polymer (PEEK), a polyetherimide (PEI), polyimide, polysulfone or a combination of one or more of the foregoing. In addition, in some cases, the matrix of a composite material described herein comprises or is formed of one or more materials including glass, ceramic or other refractory material and carbon. A matrix may also comprise or be formed of a combination of a metal, a polymeric material, a glass material, a ceramic material, and a carbon material. The composite materials described herein also include graphene particles dispersed in the matrix of the composite. Any graphene particles not incompatible with the objectives of the present disclosure may be used. According to the present disclosure, an exemplary graphene particle is a planar sheet of one atom of sp2-bonded carbon thickness that is densely clustered in a honeycomb crystal lattice. The graphene particles of a composite material described herein may be of any size or shape not inconsistent with the objects of the present disclosure. In some cases, for example, the graphene particles have an anisotropic shape, such as a rod or needle shape or a platelet shape. In some implementations, the graphene particles comprise graphene platelets, nanofiles, or nanoplates formed of one or more atomic layers of graphene. Thus, in some implementations, a graphene particle described herein comprises, consists, or consists essentially of one or more graphene sheets. A graphene sheet, in some implementations, comprises a single molecular or atomic layer with a flat planar structure. Any number of sheets not incompatible with the objectives of the present disclosure may be used. In some implementations, a graphene particle comprises a plurality of graphene sheets. The plurality of graphene sheets, in some implementations, may be arranged in a randomly stacked or laminated configuration. In other implementations, a graphene particle comprises or consists of a single graphene sheet randomly oriented. Therefore, in some implementations, a graphene particle described herein comprises one or more atomic layers of graphene. In some implementations, a graphene particle comprises between 1 and 10 atomic layers of graphene. In some implementations, a graphene particle comprises between 1 and 5 atomic layers or between 1 and 3 atomic layers of graphene. In some examples, a graphene particle comprises between 1 and 1000 atomic layers, between 1 and 500 atomic layers of graphene or between 1 and 100 atomic layers of graphene. In addition, in certain implementations comprising graphene platelets, the platelets have an average thickness of up to about 1000 nm or up to about 100 nm. In some examples, the graphene platelets have an average thickness of about 0.3 nm to about 1 nm, from about 1 nm to about 1000 nm, from about 1 nm to about 100 nm, from about 1 nm to about about 10 nm, or about 300 nm to about 1000 nm. In addition, in some cases, such graphene platelets have an average length and / or width of up to about 1 μm, up to 1 cm or up to about 5 cm. In some examples, platelets of graphene or other graphene particles have a mean length and / or an average width between about 1 μm and about 5 cm, between about 1 μm and about 1 cm, between about 1 g and about 500 μm. between about 1 μm and about 100 μm, between about 1 μm and about 10 μm, between about 5 μm and about 1 cm, between about 5 μm and about 500 μm, between about 5 μm and about 100 μm, between about 10 μm and about 1 cm, between about 5 μm and about 100 μm, between about 10 μm and about 1 cm, between about 10 μm and about 500 μm, between about 10 μm and about 100 μm, between about 50 μm and about 1 cm, between about 100 μm. pm and about 1 cm or between about 100 μm and about 500 μm. In addition, in some embodiments, the anisotropic graphene particles have a random orientation within the matrix of a composite material described herein. For example, in some cases, graphene is designed as a plurality of randomly oriented graphene platelets. A "random" orientation, for purposes of reference herein, relates to a single axis direction of the anisotropic particles. In some implementations, for example, a random orientation comprises an orientation in which the Z axes of the particles are randomly oriented in the three-dimensional space, where the Z axis of a particle may correspond to the thickness of the particle, rather than the length or width of the particle. Thus, the randomly oriented particles can contrast with the oriented or aligned particles. However, it is also possible that the graphene particles of a composite material described herein have an aligned orientation within the matrix of the composite material. Figure 1 illustrates a graphene nanoplate 10 according to one aspect of the present disclosure. As shown in FIG. 1, the graphene nanotap 10 has a length (L) along the X axis, a width (W) along the Y axis, and a thickness or height (H) along the Z axis. In other words, the L and W of the nanoplate 10 are oriented and / or aligned in the XY plane. Ordinarily, L and W are the main dimensions of the graphene nanotap 10 and the graphene nanotap is mainly oriented and / or aligned in the X-Y plane.
    [0007] However, according to the present disclosure, graphene has been shown to have beneficial and unexpected performance properties when presented in a random orientation. According to one variant, the L and the W may be from about 1 μm to about 1 cm. In another aspect, the L and W may be from about 5 μm to about 10 mm. In another aspect, the graphene nanoplates have an average H of about 1 to about 10 atomic layers. In addition, in one aspect, the graphene nanopilots 10 have a rectangular geometry in the XY plane, or may have other geometries, including, but not limited to, square, oval, hexagonal, or other polygonal geometries. . In addition, as the technology grows, the present disclosure contemplates larger and smaller graphene platelet dimensions. According to the present disclosure, graphene platelets, in some embodiments, may have a thermal conductivity of about 5300 (W / mK) in the X-Y plane. Incorporation of these graphene platelets into or onto a substrate material can improve the thermal conductivity of the substrate material.
    [0008] In one aspect, the graphene wafers are preferably distributed within a substrate material, such as, for example, a matrix of material, to produce a composite material having better thermal conductivity in one or more dimensions. The graphene particles described herein may be present in a composite material in any amount not inconsistent with the objects of the present disclosure. In some cases, for example, the composite material comprises graphene particles in an amount of about 1% by volume to about 90% by volume, based on the total volume of the composite material. In another alternative, the matrix material comprises graphene particles in an amount of from about 1% by volume to about 60% by volume, from about 1% by volume to about 40% by volume, about 1% in volume at about 20% by volume, or about 1% by volume to about 10% by volume.
    [0009] In yet another variation, the matrix material comprises graphene particles in an amount of about 5% by volume to about 30% by volume or about 5% by volume to about 20% by volume. In yet another variation, the matrix material comprises graphene particles in an amount of about 5% by volume to about 10% by volume. In a further alternative, the matrix material comprises graphene particles in an amount of from about 1% by volume to about 5% by volume. In addition, in some cases, the amount of graphene dispersed in a matrix described herein is chosen based on the thermal conductivity of the matrix and / or a desired thermal conductivity of the composite material. For example, in some examples, a greater amount of graphene is added to a matrix material having a lower thermal conductivity. In particular, in certain implementations comprising a nonconductive or barely conductive matrix material such as certain polymeric matrix materials described herein, the graphene particles are dispersed in the matrix in an amount greater than the percolation limit.
    [0010] In some implementations, the graphene particles dispersed in the matrix in an amount above the percolation limit are present in a sufficiently high concentration to provide a continuous network of graphene particles within the matrix. Such a continuous network may be formed by graphene particles in direct physical contact with each other. Also, in other cases, rather than using a higher amount of graphene, a lower amount of graphene may be added to a matrix material having higher thermal conductivity. In addition, in certain implementations, the size, shape and volume percentage of graphene particles in a matrix described herein are chosen so as to have a minimal impact on the mechanical properties and / or processability of the matrix material. For example, in some cases, graphene wafers having a thickness of up to 10 nm, a width of up to about 100 mm and a length of up to about 1 cm are used in an amount up to about 20% by volume. In some of said examples, the tensile strength and / or tensile modulus of elasticity of the matrix material is / are modified by less than about 20%, less than about 15%, by less than about 10% or less than about 5% by the inclusion of graphene platelets, with respect to the tensile strength and / or the tensile modulus of elasticity of the matrix material without graphene platelets . The tensile strength and / or modulus of elasticity of a matrix or composite material may be measured in any manner not inconsistent with the objects of the present disclosure. In some cases, the tensile strength and / or modulus of elasticity is / are measured by ASTM D3552 or ASTM E8. In some implementations, the Charpy resilience and / or the ductile-brittle transition temperature (TTDF) of the matrix material is / are modified by less than about 15%, less than about 10%, less than about 5% or less than about 1% by the inclusion of graphene platelets, relative to the Charpy and / or TTDF resilience of the matrix material without graphene platelets. Charpy resilience and / or TTDF of a matrix or composite material may be measured in any manner not inconsistent with the objectives of the present disclosure. In some cases, Charpy resilience and / or TTDF is / are measured by a four-point bend test at a temperature range or in a manner in accordance with ASTM A370 and / or ASTM E23. A composite material described herein may be manufactured in any manner not inconsistent with the objects of the present disclosure, including the following process examples. In one process, graphene particles such as graphene platelets are provided in dry form or in dispersed form in a solvent. If provided in a solvent, the graphene particles may be dispersed in a solvent having a low boiling point such as, for example, acetone, alcohol or a similar solvent. The graphene particles are then introduced into a metal mesh or fine polymer network or other porous network, including an isotropic or randomly oriented mesh or network. The graphene particles are captured on or within the mesh or lattice, and the solvent is removed by heating to form the composite material. In a variant, the wick or the network is formed of a metal such as aluminum, an aluminum alloy, copper, a copper alloy, titanium, a titanium alloy, stainless steel, brass, and combinations thereof. If desired, the process can be repeated by stacking multiple layers to form a composite building block. Alternatively, the composite block may further be worked hot and / or cold to achieve a desired thickness and density. Shaping can be performed by any method to achieve a desired shape. According to one variant, the graphene composite may be formed by thermofusion and / or extrusion of a graphene / matrix mixture. According to another variant, a graphene composite is formed by forming graphene layers in the form of a thin sheet loosely assembled with a metal matrix by thermofusion or electrolytic deposition / electrolysis to form a composite building block. The composite building blocks can then be processed as described above if desired. For example, composite building blocks can be stacked, hot-pressed, formed and / or machined / cold-formed. In another embodiment, the graphene-containing composites can be formed using randomly oriented graphene sheets and metallurgical powder treatment. In another aspect, thermally conductive materials are described herein. Such a thermally conductive material comprises a composite material described herein. Any aforementioned composite material may be used. Likewise, in another aspect, thermally conductive components are described herein. Such a component may include a thermally conductive material comprising a composite material described herein. In addition, the component may be in any form or used for any purpose not inconsistent with the purposes of the present disclosures. In some cases, for example, a thermally conductive component is a heat sink, a heat sink, or other thermal management component. Thus, the present disclosure also relates to thermal management and thermal conduction applications. In some implementations, for example, methods for thermal management of a heat sink component such as an electronic component are described herein. In some cases, such a method comprises contacting a heat-conductive material described herein with a heat-generating component, and transferring heat energy from the heat-generating component to the heat-conductive material. In addition, in certain implementations, the method further comprises the dissipation of the transferred thermal energy, including cooling by conduction with a fluid such as air or a cooling liquid. The heat energy transferred to the thermally conductive material can also be dissipated in other ways. The following example illustrates a use for graphene-containing composite materials described herein; namely, the use of such composite materials to provide thermal management for electronic components. EXAMPLE Composite Materials Composite materials containing graphene according to some of the implementations described herein are formed by extruding either (1) a mixture of aluminum and graphene platelets or (2) a blend of a composite plastic material. (graphite-reinforced plastic) and graphene platelets. Graphene platelets have a random orientation within the matrix of aluminum or composite material. The graphene platelet charge is 10% by volume, based on the total volume of the composite material. The composite materials are then formed into heat sinks for use with an electronic component. The thermal conduction properties of composite materials are compared to the thermal conduction properties of heat sinks having the same form factor but formed from (3) a mixture of aluminum with aluminum plates dispersed in the aluminum matrix or (4) aluminum plates dispersed in the graphite-reinforced plastic. Aluminum plates have the same dimensions and the same charge as graphene platelets. The four heat sinks (experimental heat sinks (1) and (2) and comparative heat sinks (3) and (4)) are then used for conductive cooling of an electronic device. The peak temperature of the device is then measured as a function of time for each theoretical dissipator. It has been discovered that heat sinks formed from a composite material described herein give better results over heat sinks that do not include graphene wafers. For example, the heat sink (1) provides a device temperature of about 10 to 15 ° less than that of the heat sink (3) at points in time between about 500 and 600 seconds, corresponding to a temperature reduction of about 9 to 14%, the percentage being based on the temperature difference divided by the temperature provided by the heat sink (3). Various implementations of the disclosure have been described in achieving the various purposes of the disclosure. It should be recognized that these implementations are merely illustrative of the principles of the present disclosure. Many modifications and adaptations thereof will be apparent to those skilled in the art without departing from the spirit and scope of the disclosure.
    权利要求:
    Claims (10)
    [0001]
    REVENDICATIONS1. Composite material comprising: a metal matrix; and a plurality of graphene platelets dispersed in the metal matrix; wherein the graphene platelets are randomly oriented in the matrix.
    [0002]
    The composite of claim 1, wherein the metal matrix is heat conductive.
    [0003]
    The composite of claim 1 or 2, wherein the metal matrix comprises aluminum, an aluminum alloy, copper, a copper alloy, titanium, a titanium alloy, or a combination thereof.
    [0004]
    4. The composite of any preceding claim, wherein the graphene platelets have an average thickness of about 1 nm to about 1000 nm.
    [0005]
    The composite of any one of claims 1 to 4, wherein: the platelets have an average thickness of about 1 nm to about 10 nm, an average length of about 1 to about 5 cm and an average width of about 1 cm to about 5 cm; and the composite comprises graphene in an amount of about 1% to about 20% by volume, based on the total volume of the matrix. 25
    [0006]
    6. Composite according to claim 5, wherein the composite material has a ductile-brittle transition temperature of the order of 15% of the ductile-brittle transition temperature of the matrix material without any graphene wafer and / or a resistance tensile in the order of 20% of the tensile strength of the matrix material without any graphene wafer. 30
    [0007]
    The composite of any one of claims 1 to 3, wherein: the platelets have an average thickness of about 0.3 nm to about 1 nm, an average length of about 1 μm to about 1 cm, and average width of about 1 μm to about 1 cm; and the composite comprises graphene in an amount of about 1% to about 20% by volume, based on the total volume of the matrix.
    [0008]
    The composite of claim 7, the composite having a ductile-brittle transition temperature of the order of 15% of the ductile-brittle transition temperature of the matrix material without any graphene wafer and / or a resistance to traction of the order of 20% of the tensile strength of the matrix material without any graphene wafer.
    [0009]
    9. A thermally conductive component comprising the composite material according to any of the preceding claims, wherein the component is a heat sink or a heat sink.
    [0010]
    10. A method of thermal management of a heating component comprising: contacting the heat-conducting material according to claim 9 with a heat-generating component; and transferring thermal energy from the heat-generating component to the thermally conductive material.
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    FR3020633B1|2021-07-16|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US7105108B2|2002-08-15|2006-09-12|Advanced Energy Technology Inc.|Graphite intercalation and exfoliation process|
    US7071258B1|2002-10-21|2006-07-04|Nanotek Instruments, Inc.|Nano-scaled graphene plates|
    US7566410B2|2006-01-11|2009-07-28|Nanotek Instruments, Inc.|Highly conductive nano-scaled graphene plate nanocomposites|
    GB0802912D0|2008-02-15|2008-03-26|Carben Semicon Ltd|Thin-film transistor, carbon-based layer and method of production thereof|
    DE102009026655B3|2009-06-03|2011-06-30|Linde Aktiengesellschaft, 80331|Method of making a metal matrix composite, metal matrix composite and its use|
    US8263843B2|2009-11-06|2012-09-11|The Boeing Company|Graphene nanoplatelet metal matrix|
    US20150241147A1|2012-10-02|2015-08-27|Vorbeck Materials|Graphene Based Thermal Management Devices|
    ITRM20120495A1|2012-10-16|2014-04-17|Univ Roma|"GNP POLYMERIC NANOCOMPOSITES FOR THE REDUCTION OF ELECTROMAGNETIC INTERFERENCES"|
    US10087073B2|2013-02-14|2018-10-02|Nanotek Instruments, Inc.|Nano graphene platelet-reinforced composite heat sinks and process for producing same|
    US10006141B2|2013-06-20|2018-06-26|Baker Hughes, A Ge Company, Llc|Method to produce metal matrix nanocomposite|ES2831327T3|2014-05-15|2021-06-08|Univ Northwestern|Ink compositions for three-dimensional printing and object-forming methods using the ink compositions|
    WO2016085584A2|2014-10-15|2016-06-02|Northwestern University|Graphene-based ink compositions for three-dimensional printing applications|
    US10793733B2|2015-04-07|2020-10-06|Northwestern University|Ink compositions for fabricating objects from regoliths and methods of forming the objects|
    US20170315596A1|2016-04-28|2017-11-02|Dell Products, Lp|Graphene Based Conformal Heat Sink and Method Therefor|
    US10829677B2|2017-06-27|2020-11-10|Ge Aviation Systems Limited|Graphene doped aluminum composite and method of forming|
    US10971281B2|2018-11-27|2021-04-06|Global Graphene Group, Inc.|Conducting polymer composite containing ultra-low loading of graphene|
    US11181323B2|2019-02-21|2021-11-23|Qualcomm Incorporated|Heat-dissipating device with interfacial enhancements|
    WO2021046069A1|2019-09-03|2021-03-11|Global Graphene Group, Inc.|Graphene-based elastic heat spreader films|
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    优先权:
    申请号 | 申请日 | 专利标题
    US14/268,052|US9932226B2|2014-05-02|2014-05-02|Composite material containing graphene|
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